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Top Ads
Rework Station
Flip Chip, BGA, 01005's, PoP, QFN cell phone PCB, integrated dispense
www.finetechusa.com
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BGA Rework Station
Advanced rework:BGA, Flip Chip, PoP QFN, 01005, integrated dispense
www.finetechusa.com
|
BGA Rework Station
Advanced rework:BGA, Flip Chip, PoP QFN, 01005, integrated dispense
www.finetechusa.com/
|
BGA Rework Station | finetechusa.com
Advanced rework:BGA, Flip Chip, PoP QFN, 01005, integrated dispense
www.finetechusa.com/
|
LED / HB-LED Packaging
Die bonding equipment with modular design for process flexibility
www.finetechusa.com/
|
Used Die Bonders - Highest placement accuracy
Modular for process flexibility
www.finetechusa.com/
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High Accuracy Die Bonders
0.5 micron placement Modular for process flexibility
www.finetechusa.com/
|
High Accuracy Die Bonders | finetechusa.com
0.5 micron placement Modular for process flexibility
www.finetechusa.com/
|
Flip Chip Bonder
Highest accuracy - 0.5 micron Process/application flexibility
www.finetechusa.com/
|
Flip Chip Bonder | finetechusa.com
Highest accuracy - 0.5 micron Process/application flexibility
www.finetechusa.com/
|
Rework Station
Flip Chip, BGA, 01005's, PoP, QFN cell phone PCB, integrated dispense
www.finetechusa.com/
|
BGA Rework Station | finetechusa.com
Advanced rework:BGA, Flip Chip, PoP QFN, 01005, integrated dispense
www.finetechusa.com
|
BGA Rework Equipment
Advanced rework:BGA, Flip Chip, PoP QFN, 01005, integrated dispense
www.finetechusa.com
|
BGA Rework Equipment | finetechusa.com
Advanced rework:BGA, Flip Chip, PoP QFN, 01005, integrated dispense
www.finetechusa.com
|
LED / HB-LED Packaging
Die bonding equipment with modular design for process flexibility
www.finetechusa.com
|
Used Finetech System
Used Rework Equipment Manual and automated, lead-free
www.finetechusa.com
|
High Accuracy Die Bonders
0.5 micron placement Modular for process flexibility
www.finetechusa.com
|
Flip Chip Bonder | finetechusa.com
Highest accuracy - 0.5 micron Process/application flexibility
www.finetechusa.com
|