If you're looking for appli-tec.com.com's Adword's Competitors iSpionage Competitor Research is the right product for you
Top Competitors for appli-tec.com
| PPC Budget | # Keywords | # Overlap kw | ||
|---|---|---|---|---|
| keypolymer.com | $102 | 288 | 13 | Learn More |
| ellsworth.com | $532 | 807 | 13 | Learn More |
| masterbond.com | $391 | 372 | 11 | Learn More |
| consumer.dow.com | $253 | 1,097 | 11 | Learn More |
| dow.com | $325 | 1,821 | 11 | Learn More |
Competitor offers & landing pages
Sample SEO Keywords for: appli-tec.com
Organic Listings | 1st Page Keywords | Avg Pos | Pos Trend | Est.Traffic | Traffic Value | |
|---|---|---|---|---|---|---|
Appli-Thane 7300 -- Premium Thermally Conductive Urethane https://www.appli-tec.com/premMar 19, 2012 - Appli-thane 730 | 1 | 16 | N/A | $0 | ||
| Keyword | Position | Trend | Search Vol | CPC | ||
| conductive urethane | 16 | 0 | N /A | |||
Aerospace Grade Adhesives - Aerospace Adhesive Suppliers - Appli ... https://www.appli-tec.com/adheFormulated for outstanding per | 1 | 14 | 10 | $0 | ||
| Keyword | Position | Trend | Search Vol | CPC | ||
| aerospace adhesive | 14 | 10 | $0.89 | |||
Sample PPC Keywords for: appli-tec.com
Top Ads
Thermally Conductive Potting | Epoxies, Compounds & Materials Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. High-performance for critical applications: aerospace, defense, medical, and industrial. www.appli-tec.com/potting/compounds High Thermal Conductivity | Adhesives, Epoxies & Urethanes Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. www.appli-tec.com/ Thermally Conductive Epoxies | Potting Compounds & Materials Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. Custom Formulations. 1.0 to 1.85 W/mK. Repeatable Results. 100% traceability. www.appli-tec.com/ High Thermal Conductivity | Adhesives, Epoxies & Urethanes Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. High-performance for critical applications: aerospace, defense, medical, and industrial. Low Tensile Modulus. 1.0 www.appli-tec.com/ | |||
Thermally Conductive Epoxies | Potting Compounds & Materials Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. www.appli-tec.com/ Thermally Conductive Epoxies | Potting Compounds & Materials Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. www.appli-tec.com/potting/compounds High Thermal Conductivity | Adhesives, Epoxies & Urethanes Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. High-performance for critical applications: aerospace, defense, medical, and industrial. Low Tensile Modulus. 1.0 www.appli-tec.com/conductive/adhesives Thermally Conductive Epoxies | Potting Compounds & Materials Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. High-performance for critical applications: aerospace, defense, medical, and industrial. 1.0 to 1.85 W/mK. Custom www.appli-tec.com/potting/compounds | |||
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High Thermal Conductivity | Adhesives, Epoxies & Urethanes Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. High-performance for critical applications: aerospace, defense, medical, and industrial. ASTM-E595 Low Outgas. 1. www.appli-tec.com/conductive/adhesives Thermally Conductive Epoxies | for High-Heat Microelectronics Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. High-performance for critical applications: aerospace, defense, medical, and industrial. www.appli-tec.com/conductive/adhesives Thermally Conductive Epoxies | for High-Heat Microelectronics Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. www.appli-tec.com/conductive/adhesives Thermally Conductive Epoxies | Potting Compounds & Materials Engineered to efficiently dissipate heat for electronic assemblies, devices & sensors. High-performance for critical applications: aerospace, defense, medical, and industrial. Custom Formulations. 1.0 www.appli-tec.com/potting/compounds | |||
High Thermal Conductivity | Epoxy Potting Compounds 1.70 to 2.5 W/mK thermally conductive epoxies efficiently dissipate high heat. Electrically Insulative. Low Tensile Modulus. 0.2 - 2.5 W/mK. ASTM-E595 Low Outgas. Self-leveling Consistency. Types: Aer www.appli-tec.com/high-thermal/potting High Thermal Conductivity | Adhesives, Epoxies & Urethanes Engineered to efficiently dissipate heat, improve sheer strength and reduce ITR. 0.2 - 2.5 W/mK. Self-leveling Consistency. Electrically Insulative. Low Tensile Modulus. ASTM-E595 Low Outgas. Types: A www.appli-tec.com/high-thermal/conductivity High Thermal Conductivity | Adhesives, Epoxies & Urethanes Engineered to efficiently dissipate heat, improve sheer strength and reduce ITR. Electrically Insulative. 0.2 - 2.5 W/mK. Self-leveling Consistency. ASTM-E595 Low Outgas. Low Tensile Modulus. Types: A www.appli-tec.com/high-thermal/conductivity Thermally Conductive Adhesives | for High-Heat Electronics 1.70 to 2.5 W/mK thermally conductive epoxies efficiently dissipate high heat. www.appli-tec.com/thermally/conductive | |||
High Thermal Conductivity | Adhesives, Epoxies & Urethanes Engineered to efficiently dissipate heat, improve sheer strength and reduce ITR. Electrically Insulative. www.appli-tec.com/high-thermal/conductivity Aerospace Urethane Adhesives | Longer Pot Life, Shorter Cures Outstanding performance for adverse high temperature and vibration conditions. www.appli-tec.com/aerospace/adhesives High Thermal Conductivity | Epoxy Potting Compounds 1.70 to 2.5 W/mK thermally conductive epoxies efficiently dissipate high heat. ASTM-E595 Low Outgas. Self-leveling Consistency. 0.2 - 2.5 W/mK. Low Tensile Modulus. Electrically Insulative. www.appli-tec.com/high-thermal/potting Thermally Conductive Adhesives - for High-Heat Electronics 1.70 to 2.5 W/mK thermally conductive epoxies efficiently dissipate high heat. 0.2 - 2.5 W/mK. www.appli-tec.com/thermally/conductive | |||
High Thermal Conductivity | Epoxy Potting Compounds 1.70 to 2.5 W/mK thermally conductive epoxies efficiently dissipate high heat. Electrically Insulative – Self-leveling Consistency – 0.2 - 2.5 W/mK – Low Tensile Modulus – ASTM-E595 Low Outgas – Types www.appli-tec.com/high-thermal/potting High Thermal Conductivity | Adhesives, Epoxies & Urethanes Engineered to efficiently dissipate heat, improve sheer strength and reduce ITR. www.appli-tec.com/high-thermal/conductivity High Thermal Conductivity | Epoxy Potting Compounds | appli-tec.com 1.70 to 2.5 W/mK thermally conductive epoxies efficiently dissipate high heat. www.appli-tec.com/high-thermal/potting Thermally Conductive Adhesives | for High-Heat Microelectronics Engineered to efficiently dissipate heat, improve shear strength and reduce ITR. www.appli-tec.com/thermally/conductive | |||
High Thermal Conductivity | Epoxy Potting Compounds 1.70 to 2.5 W/mK thermally conductive epoxies efficiently dissipate high heat. www.appli-tec.com/high-thermal/potting |
